epoxy adhesives Products
Construction Chemicals
Leading manufacturers & exporters of high grade building materials such as concrete reinforcement fibers, ar glass fibre, heat insulation coatings, frp pigment paste, industrial cellulose fibers, application in textured paints, unidirectional glass fiber mats, metallic floor hardener, sbr latex, non
Address: 218, Sagar Prabhat Co-Op Industrial Estate, Dahisar Check Naka, Dahisar (East)
Mumbai Maharashtra India 400 068
Phone:(91)-(22)-32937349
Website: https://www.eindiabusiness.com/company/81250/riddhi-enterprise-dahisar.html
KB 1689
Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1689 can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +135°C. It is an outstanding adhesive that offers superb bond strength, peel strength and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1689 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.8 – 2.3 W/m/K), it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a gray color. Owing to its versatile performance, KB 1689 is widely used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications. PRODUCT HIGHLIGHTS Easy mix ratio of 1:1 by weight Outstanding toughness Superior thermal conductivity Cost effective Very low volume resistivity (< 0.005 ohm-cm) Cryogenically serviceable TYPICAL APPLICATIONS Bonding Sealing Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-1689/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html
Kurikkal Weather Guard Products
Wholeseller and trading of tile fixing adhesives, stock labels adhesives, tape adhesives, bottle labeling adhesives, home cleaners, waterproofings, pipe sealants, epoxy adhesives.
Address: 5/2975, 2nd Floor, Dream World Complex, Bye Pass Road, Opp. Baby Memorial Hospital, Calicut
Kozhikode India
Phone:919249456781
Website: https://www.eindiabusiness.com/company/258327/kurikkal-weather-guard-products.html
TUF 1828 TC
Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 – 40 × 10-6 m2·K/W. Since TUF 1828 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 – 6 × 10-6 m2·K/W. TUF 1828 TC is cryogenically serviceable. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties. It has a gray color. Owing to its sensational thermal management properties and low outgassing properties TUF 1828 TC is widely used in electronics, optical, aerospace, specialty OEM and cryogenic industries. PRODUCT HIGHLIGHTS Unrivaled heat transfer efficiency Cryogenically serviceable Superb mechanical strength properties Microns thin bond lines achievable Capable of passing NASA low outgassing Unlimited working life at room temperature TYPICAL APPLICATIONS Bonding Sealing Packaging : Cans, Pails, Syringes Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595) Learn more : http://www.kohesibond.com/product/tuf-1828-tc/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html
KB 1631 HTC-1
Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +200°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications. PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Thixotropic Paste Superior dimensional stability Exceptional electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Packaging : Pails and Cans Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595) Learn more : http://www.kohesibond.com/product/kb-1631-htc-1/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html
